Manufacturing

Established in 1983, Filtran Microcircuits Inc. (FMI) is a world leader in the research and fabrication of high resolution circuit boards. Operating from a 20,000 sq. ft. facility in Ottawa, FMI has earned a reputation for producing technically intricate circuits and superior workmanship, as well as for meeting delivery schedules.

Products

• microstrip, bonded stripline, thick metal-backed PTFE, mixed dielectric multilayer
• operating frequencies typically in the range of 500 MHz to 100 GHz
• prototyping, quickturn, production

Materials

• teflon PTFE (Duroid) laminates, any microwave materials from Rogers, Arlon or Taconic
• thick metal backing: Al, Cu, Brass
• hard substrates such as ceramics (Al2O3 ), Ferrites, Glass, etc...

Innovative Processing

• 1 mil lines and spaces
• ±.2 mil embedded resistors
• proprietary sodium etch for reliable PTH and edge plating
• proprietary sputtering techniques for blind holes in thick metal-backed PTFE
• proprietary copper Thin Film metallization on ceramic
• high purity, wire-bondable gold
• aspect ratios: up to 10:1

Machining Capabilities

• complex board shapes fabricated using CNC routing, milling, laser machining • machining tolerances: ±.005", down to ±.001"

Quality Assurance

• stringent program of in-process inspection to meet customer specified standards such as Military 55110, IPC-HF-318 or IPC-RB-276 depending on customer's needs
• ISO 9001:2000

Applications

• satellite, aerospace, PCS telecommunications, fibre optic telecommunications, automotive, navigation, defense, and high speed digital interconnect circuitry

Worldwide Clientele

• Alcatel, Signal Technologies, Arcom, Trak, Raytheon, Harris Corp., Filtronic Solid State, M/A Com, C.T.I, Nortel...
• Canada, US, UK, France, South Africa, Singapore, Argentina.

	High-resolution, gold plated circuit on 5880 Duroid featuring: • 3 mil gaps • operation at 18 GHz
	Gold plated circuitry and aluminum backing on TMM Board
	Aluminum-backed gold circuit featuring: • sputtered blind holes • tin/lead circuitry • gold and chromate on aluminum
	Aluminum-backed TMM circuit featuring: • sputtered blind holes • gold plating • 1.5 mil lines and spaces
	Duroid circuit with gold plated (filter) structure
	Laser machined PTFE circuit
	Thin-film ceramic circuits featuring: • gold plating for wire bonding • resistors • plated through holes
	Complex machining of heatsinked boards
	Bonded multilayer PTFE featuring: • plated through holes • plated edges
	R-4 circuit featuring: • spiral inductors • 3 mil lines and spaces • tight tolerance (± .00025") • gold over nickel plating for wire bonding
	Aluminum-backed PTFE circuit
	TMM circuit with gold over nickel on aluminum backing featuring: • sputtered blind holes • fused tin/lead
	TMM circuit with gold over nickel on aluminum backing featuring: sputtered blind holes fused tin/lead
	Aluminum-backed PTFE circuit with nickel and gold plating on both copper circuitry and aluminum.

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